BGA REBALLING + ASSECCORIES

A newest BGA Kit with 81 pcs reballing rework stencils, widely used and directly heated, 4 bottle 25K solder balls and some other accessories is on sale, which is not home made, but made by Professional Manufacturer.

Description :

A. 81 pcs reballing rework stencil

(a) Used for 0.45mm solder ball (5 PCS)
DDR1
DDR2
DDR3 / / XBOX360 Cache Universal
AC82GM45 / / 82PM45 / / 82GL40 / / AC88CTPM Universal

(b) Used for 0.5mm solder ball (23PCS)
215-0719090
215-0669065
G96-600-A1
G94-300-A1
ATI200M RC415MD / / ATI 700M Universal
SB700 / / RD780 Universal
ATIIXP600 / / SB600 Universal
ATIRS800ME / / RS600ME Universal
G200-103-B1
NF-7150-630I-A2
MCP67MV-A2 / / MCP77MV-A2 Universal
945GMS
945GM / / 945PM Universal
ATI21514 / / 216PVAVA12FG / / 215CDABKA15FG / / X2600PRO / / M64-M / / M74-M
ATI21515 / / 216-0707011 / / M72-S / / M82-S Universal
GF GO7200 / / 7300 / / 7400 / / 6200AGP / / G86-630-A2 Universal
NF-6100-N / / 8200 / / 8400 / / 8600 Universal
ATI1100 / / 1150 Universal
ATI IXP460
915GMS
ATIX1300
82PM965 / / GM965 GM
0.5mmuniversal stencil (29 * 30.5mm) (10 000 mesh)

(c) Used for 0.6mm solder ball (44PCS)
NV GO6800-B1
NV 6800LE
ATI X1800
ATI9000 64M
9000 IGP
9100 IGP
SIS671 / / SIS671DX Universal
SIS661FX
NF550 / / NF570 Universal
FX5700
HSI-A4
G80-100-K1
ATI200M / / RS480M / / 216MPA4AKA22 / / M64-P Universal
ATI IXP400 / / IXP450 Universal
ATI7500 / / 9000 / / CSP-32 GM
4200GO
NV GO6200 / / 7200 / / 7300 / / 7400 / / G84-303-A2 / / G86-771-A2 Universal
ATI9200 / / 9600 / / 9700 / / X300 / / X600 Universal
RC410 / / 200M
865PE
VT8237A / / VT8237 / / VT8235 Universal
VT8237R
NF4-N-A3 / / NF4-A3 Universal
ATIX1600 / / RV516 / / X1300 / / X700 Universal
SIS964L
SIS965L
MX440
NF430-N-A3 / / NF-410-N-A3 Universal
82915PM / / 915GM Universal
NF-G6150-N-A2 / / NF-6100-A2 Universal
GO5200
FGO5200
VIA CN896 / / VN896 / / P4M900 Universal
82801GBM / / 82801GR / / 82801GB Universal
82801FBM
82801HBM / / 82801IBM Universal
82801IB
82801BA
82X38
NF250
R480
0.6 universal stencil (pitch = 1.0mm) 41 * 41MM widely used
0.6 universal stencil (pitch = 1.1mm) 33 * 33MM widely used
0.6 universal stencil (pitch = 0.9mm) 38.5 * 38.5MM widely used

(d) Used for 0.76mm solder ball (10PCS)
845GL / / 845GV Universal
845MP / / 855PM Universal
855GM / / 855GME Universal
M1671
82801EB
82801DBM / / DB Universal
SIS630S
SIS630E
SIS650
0.76 universal stencil (pitch = 1.27mm) 41.5 * 41.5MM widely used

B. 4 Bottles of 25K leaded solder balls

A bottle of 0.45mm leaded solder ball
A bottle of 0.5mm leaded solder ball
A bottle of 0.6mm leaded solder ball
A bottle of 0.76mm leaded solder ball
Solder ball alloy content: SN63PB37 (Sn 63% Pb 37%)
Melting point: 183 degrees Celsius.

C. 10ml Amtech Flux Patse

D. 1cm Kapton Tape

E. Desldering Wick

F. Soldering Scraper

G. Antistatic Brush

Important Note: All of these stencils in the kit can be directly heated.
                       
Tips: We can supply Multiple BGA Reworking/Soldering Materials, such as reworking station, stencils，solder balls, solder paste and so on, if you need any of them or others, please feel free to contact us.

Package included:

• 81 x reballing rework stencil
• 4 x 25K leaded solder balls
• 1 x 10ml Amtech Flux Patse
• 1 x 1cm Kapton Tape
• 1 x Desldering Wick
• 1 x Soldering Scraper
• 1 x Antistatic Brush