Features :
(Lead free compatible)
Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled µBGA .. etc .
Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields .
Complete reworking Processes (Pre-Heating, Soak, Re-Flow & cooling) stages are achieved for an accurate and standard reworking...
